Description
🔧 Bond with Confidence!
- QUICK CURING - Rapid skin formation and handling time—get back to work in no time!
- VERSATILE USE - Perfect for overhead or vertical surfaces with a dry medium paste.
- SUPERIOR CONDUCTIVITY - Experience top-tier performance with silver plated aluminum filler.
- EFFORTLESS APPLICATION - No weighing or mixing required—just open and use!
- CORROSION RESISTANCE CHAMPION - Outstanding protection against galvanic corrosion on aluminum substrates.
The Parker Chomerics Cho-Bond 1075 is a one-component, easy-to-use adhesive kit designed for superior conductivity and corrosion resistance. With a quick working life and no mixing required, it’s perfect for professionals seeking efficiency and reliability in their projects.
