Description
- SUPERIOR THERMAL PERFORMANCE- Engineered and made by 3M corporation to meet OEM specifications for the best combination of maximum performance and durability and is packaged by Innovation Cooling for retail sale.
- SUPERIOR RELIABILITY- Used in mission critical applications for the military defense sector in Aviation and Naval electronics. High/Tight particle density seals in liquids and retards fluid loss lasting 3 to 4X times typical Asian retail repacks.
- INTENDED USE INCLUDE but not limited to CPU,GPU Game Stations, LED Lighting, IC Packaging, Battery Thermal Management.
- CONTAINS 92% PURIFIED SYNTHETIC MICRONIZED DIAMOND - a natural thermal superconductor with a conductivity of 2,000-2,500 W/mK compared to 406-429 W/mK for pure silver.
- WILL NOT PUMP OR BAKE OUT - when properly used and is neither Non capacitive or electrically conductive. C of C available on Request.
Size Name:1.5 Grams
Electronics Grade OEM Thermal Compound with high particle density/purity for consistent reliable performance.
