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* 830 tie-point solderkess breadboard Perfect for ardunio shield prototyping and testing. Plastic housing, metal contact clips. Accept wire with diameter 20~29AWG. Voltage: 300V. Current: 3~5A. Size: 16.5 x 5.5 x 0.85 cm. 830 tie points total: 630 tie-point IC-circuit area plus two 100 tie-point distribution strips providing 4 power rails. * U shape jumper 140Pcs Pre-formed 22 AWG. * Flexible jumper 65Pcs For solderless breadboard. Male to male. Material - pure copper wire,PVC,Good conductivity. Flexible, easy to trace, easy to connect and disconnect.
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