Description
🚀 Elevate Your Cooling Game with Chip Quik!
- DEEP SPACE TECHNOLOGY - Utilizes advanced liquid metal technology for superior performance.
- PRECISION APPLICATION - Comes in a convenient 1g/1cc syringe for mess-free application.
- STAY AHEAD OF THE GAME - Join the elite with this cutting-edge thermal compound.
- IDEAL FOR PROFESSIONALS - Perfect for tech enthusiasts and professionals seeking top-tier thermal solutions.
- UNLEASH THE POWER OF HEAT TRANSFER - Experience unparalleled thermal conductivity with 79 W/mK.
The Chip Quik TC4-1G Heat Sink Thermal Compound is a high-performance solder paste featuring deep-space liquid metal technology, boasting an impressive thermal conductivity of 79 W/mK. Packaged in a user-friendly syringe, it ensures precise application for optimal heat transfer in various electronic applications.
